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Intel Installs Tools at Fab 62 and Updates Ohio Chip Fab

Intel is making notable progress on its American semiconductor manufacturing expansion, marking key milestones at both its Arizona and Ohio facilities.

Intel Installs Tools at Fab 62 and Updates Ohio Chip Fab

Arizona Expansion and Fab 62 Progress

Intel has announced that it has started installing production tools at its Fab 62 facility in Arizona, keeping the fab on track for potential mass production by late 2028. According to reports from Tom's Hardware, the company has completed construction of the Fab 62 shell and is now moving forward with equipment installation, though it has not yet disclosed a definitive timeline for high-volume production or specified which exact nodes the facility will produce. Further details are available from Tom's Hardware in the original source material.

When Intel initially announced Fab 52 and Fab 62 at its Ocotillo campus in Arizona, the company stated that both facilities would manufacture its most advanced process technologies, including the Intel 20A and Intel 18A classes. While neighboring Fab 52 has been designated for Intel 18A manufacturing, Fab 62 currently remains unassigned. Based on Intel's process roadmap, the facility could potentially accommodate additional Intel 18A capacity or shift toward next-generation Intel 14A process technology, though management has yet to officially confirm its final production plans.

Intel
(Image credit: Intel) · Source: Tom's Hardware

High-NA EUV Lithography Integration

In addition to physical facility expansions, Intel has confirmed the integration of High-NA EUV lithography into high-volume manufacturing. As the first chipmaker to install a commercial High-NA EUV scanner at its D1X fab near Hillsboro, Oregon, Intel has utilized the next-generation equipment to produce select tiles for Panther Lake CPUs. Operating out of the Gordon Moore Park at Ronler Acres, development teams use the tools to better understand lithography mechanics, even as current deployments often map to the same circuits produced by standard Low-NA EUV systems.

Intel
(Image credit: Intel) · Source: Tom's Hardware

Ohio One Manufacturing Complex Update

Intel has also shared an update on the progress of its 'Ohio One' manufacturing complex located in New Albany, Ohio. Construction crews recently hit a significant structural milestone by installing the first major structural truss at the site's initial semiconductor fab. This development underscores Intel's ongoing long-term commitment to boosting domestic chip fabrication capacity.

Despite the visible construction milestone, Intel has not yet provided an updated schedule detailing when the first Ohio fab will officially become operational. Furthermore, the company has refrained from disclosing the anticipated wafer manufacturing capacity or the specific process technology nodes that will eventually be deployed at the New Albany location.

Mask
(Image credit: Intel) · Source: Tom's Hardware

Broader U.S. Supply Chain and Investment

Beyond wafer fabrication, Intel continues to invest heavily across its domestic footprint. Oregon acts as the primary research and development hub for advanced logic and 3D interconnects, while Arizona houses packaging, assembly, and testing capabilities. Additionally, Intel utilizes its facility in New Mexico to build complex multi-chiplet processors using advanced packaging methods like EMIB and Foveros technologies.

To further solidify its domestic supply chain, Intel recently broke ground on a new photomask manufacturing facility in Santa Clara, California. By maintaining domestic capabilities across R&D, fabrication, packaging, and photomask production, Intel works with more than 4,500 suppliers across 49 states, fueled by annual domestic expenditures exceeding $29 billion.

Sources

  • Tom's HardwareIntel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab

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